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  • Welcome to the website of Shenzhen Pinspeed Technology Co., Ltd.!
  • Welcome to the website of Shenzhen Pinspeed Technology Co., Ltd.!

Service Hotline:+86-400-7788-990

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  • Application of automatic glue filling machine in electric tools?

    Application of automatic glue filling machine in electric tools?

    The application of automatic glue filling machine in electric tools is mainly manifested in the controller glue filling. After pouring the glue, the effect of shockproof and waterproof can be realized. Electric tools will vibrate in the work, more damage, through glue fixed, can effectively anti-seismic, so as to improve the stability and reliability of electric tools.

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  • What are the applications of automatic glue filling machine in automobile industry?

    What are the applications of automatic glue filling machine in automobile industry?

    Automatic glue filling machine is widely used in automobile industry. Automotive electronics can achieve waterproof, shockproof, dust-proof, corrosion-resistant, fixed and other functions by pouring glue, so as to improve the stability and reliability of automotive products.

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  • Requirements for glue of inductance coil glue filling machine

    Requirements for glue of inductance coil glue filling machine

    Two component epoxy resin is commonly used in inductance coil gluing machine. That is, AB glue, its package is a glue, the other barrel is B glue, two kinds of glue mix together according to the proportion will solidify. According to the color, epoxy resin commonly used in inductance coil can be divided into transparent, black and milky white, etc. according to the mixing ratio, there are generally 1:1, 2:1, 3:1 and black 4:1 or 5:1.

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  • Application of automatic glue filling machine

    Application of automatic glue filling machine

    Glue pouring machine is also called AB glue pouring machine. It is mainly used to mix AB glue according to the specified proportion and the specified amount to pour it on the surface or inside of the product to play a fixed and waterproof role.

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  • Three problems in dispensing mobile phone screen

    Three problems in dispensing mobile phone screen

    Mobile phones are high-tech products, and the fear is that there will be quality problems. Mobile phone screen dispensing problems will lead to the scrapping of mobile phone screen. Proper dispensing equipment is needed to ensure the quality of mobile phone screen and mobile phone packaging. For example: the use of mobile phone screen dispensing, fully automatic dispensing function to improve the quality and speed of mobile phone screen dispensing, reduce the quality problems of mobile phone.

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  • Requirements for sensor dispensing

    Requirements for sensor dispensing

    With the development of electronic computer and information technology, the demand for sensors is increasing rapidly, and it is becoming more and more important in mobile phones and other electronic devices. Most distance sensors used in mobile phones and other electronic products need to be finished by dispensing. Dispensing is to eliminate the clutter of sensors, eliminate interference, avoid sensor misjudgment, and achieve a high accuracy In order to meet the needs of the market, the performance of relevant manufacturing equipment such as dispenser and dispenser needs to be further improved.

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  • Two main applications of CCD automatic dispensing machine

    Two main applications of CCD automatic dispensing machine

    With the rapid development of industry, the visual dispenser is favored in the application field of the whole industry. The main reason is that it has a large storage hard disk, as well as the attached visual detection and positioning system, which can effectively assist program editing and track the coordinate track in real time, thus improving the efficiency of programming. So what are the applications of visual dispenser with such advantages?

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  • Application of automatic dispenser in chip industry

    Application of automatic dispenser in chip industry

    With the continuous development of society, today's era is an information age. Semiconductors and integrated circuits have become the theme of this era. Chip packaging process directly affects the mechanical properties of semiconductors and integrated circuits. Chip packaging has always been a big problem in industrial production. So how to overcome this problem and how to apply it to chip industry?

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