Application of automatic dispenser in chip industry

With the continuous development of society, today's era is an information age. Semiconductors and integrated circuits have become the theme of this era. Chip packaging process directly affects the mechanical properties of semiconductors and integrated circuits. Chip packaging has always been a big problem in industrial production. So how to overcome this problem and how to apply it to chip industry?

1、 Chip bonding

PCB is easy to shift during bonding. In order to avoid removing or replacing electronic components from PCB surface, we can use automatic adhesive machine to glue the surface of PCB, and then heat it into the oven. In this way, the electronic components can be firmly attached to the PCB.

2、 Bottom material filling

I believe that many technicians encounter such a difficult problem in the process of chip flip chip, because the fixed area is smaller than the chip area, so it is difficult to combine. If the chip is impacted or heated and expanded, it is easy to cause bump fracture, and the chip will lose its due performance. To solve this problem, we can inject the organic glue into the gap between the chip and the substrate through the automatic dispensing machine, and then solidify. In this way, the bonding area between the chip and the substrate is effectively increased, and the bonding strength is further improved, which has a good protection effect on the bumps.

3、 Surface coating

When the chip is welded, we can apply epoxy resin with low viscosity and good fluidity between the chip and the solder joint through the automatic dispensing machine. In this way, the chip can not only improve the appearance of the chip, but also prevent corrosion and stimulation of foreign matters, which can protect the chip and prolong the service life of the chip!

To sum up, the above is the application of automatic dispensing machine in chip bonding, substrate filling, surface coating and other chip packaging industries. We can apply this method to our daily work, which will greatly improve our work efficiency. With this method, we don't have to worry about chip packaging any more!